TDA1170D low-noise tv vertical deflection system december 1992 . complete vertical deflection sys- tem . low noise . suitable for high definition moni- tors description the tda 1170d is a monolithic integrated circuit in a 16-lead dual in-line plastic package. it is intended for use in black and white and colour tv receivers. low-noise makes this device particularly suit- able for use in monitors. the functions incorpo- rated are : synchronization circuit, oscillator and ramp generator, high power gain amplifier, flyback generator, voltage regulator. 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 ramp generator compensation amplifier input ground ground oscillator sync. input height adjust ramp output supply voltage flyback ground ground power amplifier output regulated voltage power amplifier supply voltage 1170d-01.eps pin connections dip16 (plastic package) order code : TDA1170D 1/8
oscillator voltage regulator power ampliflier preampliflier buffer stage sync circuit ramp generator flyback generator sync yoke linearity height freq +v s 2 1 3 11 87 10 916 14 15 6 4 5 12 13 TDA1170D 1170d-02.eps block diagram absolute maximum ratings symbol parameter value unit v s supply voltage at pin 2 35 v v 6 ,v 7 flyback peak voltage 60 v v 14 power amplifier input voltage + 10 0.5 v v i o output peak current (non repetitive) at t = 2msec 2 a i o output peak current at f = 50hz t 10 m sec 2.5 a i o output prak current at f = 50hz t > 10 m sec 1.5 a i 3 pin 3 dc current at v 6 TDA1170D 2/8
electrical characteristics (refer to the test circuits, v s = 35v, t amb =25 o c, unless otherwise specified) dc characteristics symbol parameter test conditions min. typ. max. unit fig. i 2 pin 2 quiescent current i 3 =0 7 14 ma 1b i 7 pin 7 quiescent current i 6 =0 8 17 ma 1b i 11 oscillator bias current v 11 = 1v 0.1 1 m a1a i 14 amplifier input bias current v 14 =1v 1 10 m a1b i 16 ramp generator bias current v 16 = 0 0.02 0.3 m a1a i 16 ramp generator current i 9 =20 m a, v 16 = 0 18.5 20 21.5 m a1b d i 16 i 16 ramp generator non-linearity d v 16 = 0 to 12v, i 9 =20 m a 0.2 1 % 1b v s supply voltage range 10 35 v v 1 pin 1 saturation voltage to ground i 1 = 1ma 1 1.4 v v 3 pin 3 saturation voltage to ground i 3 = 10ma 300 450 mv 1a v 6 quiescent output voltage v s = 10v r1 = 1k w ,r2=1k w 4.1 4.4 4.75 v 1a v s = 35v r1 = 3k w ,r2=1k w 8.3 8.8 9.45 v 1a v 6l output saturation voltage to ground i 6 = 0.1a i 6 = 0.8a 0.9 1.9 1.2 2.3 v v 1c 1c v 6h output saturation voltage to supply i 6 = 0.1a i 6 = 0.8a 1.4 2.8 2.1 3.2 v v 1d 1d v 8 regulated voltage at pin 8 6.1 6.5 6.9 v 1b v 9 regulated voltage at pin 9 i 9 =20 m a 6.2 6.6 7 v 1b d v 8 d v s , d v 9 d v s regulated voltage drift with supply voltage d v s = 10 to 35v 1 mv/v 1b v 14 amplifier input reference voltage 2.07 2.2 2.3 v r10 pin 10 input resistance v 10 0.4v 1 m w 1a 1170d-03.tbl TDA1170D 3/8
figure 1 : dc test circuit 10 11 6 327 916 14 4 5 12 13 TDA1170D v3 i3 i10 - i11 1v 1v 8v - i16 r2 r1 v6 +vs 1k w 1170d-03.eps figure 1a 27 16 14 4 5 12 13 TDA1170D - i16 +vs i2 i7 11 8 v8 9 - i14 v9 1v 100k w 1170d-04.eps figure 1b 27 14 4 5 12 13 TDA1170D 11 +vs 4v 6 i6 v6l 1170d-05.eps figure 1c 27 14 4 5 12 13 TDA1170D 11 +vs 6 i6 1v v6h 1170d-06.eps figure 1d TDA1170D 4/8
electrical characteristics (refer to the ac test circuit, v s = 22v ; f = 50hz ; t amb =25 o c, unless otherwise specified) ac characteristics symbol parameter test conditions min. typ. max. unit i s supply current i y = 1app 140 ma i 10 sync. input current (positive or negative) 500 m a v6 flyback voltage i y = 1app 45 v t fly flyback time i y = app 0.7 ms v on peak to peak output noise pin 11 connected to gnd 40 mv pp f o free running frequency (p1 = r1) = 260k w , c2 = 0.1 m f (p1 = r1) = 300k w , c2 = 0.1 m f 48.5 42.2 hz hz d f synchronization range i 8 = 0.5ma 14 hz d f d v s frequency drift with supply voltage v s = 10 to 35v 0.005 hz/v d f d t pins frequency drift vs. pins 4, 5, 12 and 13 temp. t pins = 40 to 120 c 0.01 hz/ c 1170d-04.tbl 3 2 11 10 1 7 6 9 8 1n4001 100pf sync. input s p1 c2 r1 470pf t d a 1 1 7 0 d d v v rf rf 15 16 14 4 5 12 13 0.1mf 1w 470 m f 100 m f 0.1 m f 220k w 0.1 m f 120k w 910k w 0.1 m f 0.1 m f 100k w 47k w 1.8k w 22k w 10 m f 1000 m f 3.3 w 220k w 5.6k w 5.6k w yoke ry = 10 w ly = 20mh v = 22v 1170d-07.eps figure 2 : ac test circuit TDA1170D 5/8
3 2 11 10 1 7 6 9 8 1n4001 100pf s p1 f sync = 50hz 470pf c1 c4 d1 c5 c10 c9 c6 r11 r13 r10 c11 r6 r12 p3 r7 r9 c7 c12 c8 r3 p2 c3 r2 r4 c2 r1 v = 12v 4 5 12 13 15 14 16 t d a 1 1 7 0 d r8 r5 0.1 m f 100 m f 470 m f 0.1 m f 4.7k w 100k w 150k w 220k w 0.1 m f 220k w 910k w 0.1 m f 0.1 m f 100k w 82k w 1.8k w 1 w 0.1 m f 3.3 w 150k w 22k w 1.8k w 2.2k w 270 w 100 m f 2200 m f yoke ry = 2.9 w ly = 6mh 1170d-08.eps figure 3 : typical application circuit for smal screen b/w tv set (ry = 2.9 w , ly = 6mh, iy = 1.1app) 1170d-09.tif figure 4 : p.c. board and components layout of the circuit of fig. 3 (1 : 1 scale) TDA1170D 6/8
mounting instruction the r th j-amb of the tda 1170d can be reduced by soldering the gnd pins to a suitable copper area of the printed circuit board (fig. 5) or to an external heatsink (fig. 6). the diagram of figure 7 shows the maximum dissi- pable power p tot and the r th j-amb as a function of the side olo of two equal square copper areas having a thickness of 35 m (1.4 mils). during soldering the pins temperature must not exceed 260 c and the soldering time must not be longer than 12 seconds. the external heatsink or printed circuit copper area must be connected to electrical ground. 1170d-11.eps figure 6 : external heatsink mounting example 1170d-10.eps figure 5 : example of p.c. board copper area which is used as heatsink 1170d-12.eps figure 7 : maximum dissipable power and junction-ambient thermal resistance versus side olo 1170d-13.eps figure 8 : maximum allowable power dissipation versus ambient temperature TDA1170D 7/8
information furnished is believed to be accurate and reliable. however, sgs-thomson microelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. no licence is granted by implication or otherwise under any patent or patent rights of sgs-thomson microelectronics. specifications mentioned in this publication are subject to change without noti ce. this publication supersedes and replaces all information previously supplied. sgs-thomson microelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of sgs-thomson microelectronics. ? 1994 sgs-thomson microelectronics - all rights reserved purchase of i 2 c components of sgs-thomson microelectronics, conveys a license under the philips i 2 c patent. rights to use these components in a i 2 c system, is granted provided that the system confo rms to the i 2 c standard specifications as defined by philips. sgs-thomson microelectronics group of companies australia - brazil - china - france - germany - hong kong - italy - japan - korea - malaysia - malta - morocco the netherlands - singapore - spain - sweden - switzerland - taiwan - thailand - united kingdom - u.s.a. 16 18 i a1 l be d b z e3 f b1 e 9 pm-dip16.eps package mechanical data 16 pins - plastic package dimensions millimeters inches min. typ. max. min. typ. max. a1 0.51 0.020 b 0.77 1.65 0.030 0.065 b 0.5 0.020 b1 0.25 0.010 d 20 0.787 e 8.5 0.335 e 2.54 0.100 e3 17.78 0.700 f 7.1 0.280 i 5.1 0.201 l 3.3 0.130 z 1.27 0.050 dip16.tbl TDA1170D 8/8
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